Senior rf packaging engineer
microTECH Global Ltd
...of packaging materials, unit processes, and design for manufacturability (DFM).- Experience in the electro:optical domain is a plus.- Proficiency in 3D EM simulators (Ansys HFSS, CST Studio Suite, or equivalent) and circuit design tools (Keysight ADS, Cadence/AWR, Altium, or equivalent).- Strong willingness to cooperate and [...]
Kategorie Medien / Verlag / Redaktion