Senior electronics design engineer - avionics
RockledgeGE Aerospace
...in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board. Experience in design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics) Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN. Experience with OpenVPX and PIC-SIG standards. [...]
Kategorie Handel